Digimat-AM_Solvay logo for PR
Solvay has added two of its high-performance polymer materials to the latest release of e-Xstream’s Digimat Additive Manufacturing software.
The company’s carbon fibre-filled KetaSpire polyetheretherketone (PEEK) and neat Radel polyphenylsulfone (PPSU) join the neat KetaSpire PEEK already available for simulation on the platform.
Digimat AM is used by engineers to carry out detailed analysis of materials, taking into account the impact the additive manufacturing process could have on the final part. With the software’s Advanced Solver functionality, users can benefit from accurate predictive modelling data across a range of characteristics, like warpage and residual stress, to enable process optimisation, and minimise the risk of defects to the part before it is printed. Digimat also predicts the part performance as a function of the material and printing process parameters.
Solvay has thus moved to ensure more of its engineering-grade polymer materials are available to be ran through Digimat’s simulation processes, in order to increase the chance of successful first time prints for users of the materials and software.
“Our growing range of AM filaments underscores Solvay’s determination to establish itself as an industry leader in this rapidly evolving market,” commented Christophe Schramm, Additive Manufacturing Business Manager, Specialty Polymers, Solvay. “Digimat-AM allows customers to simulate the printing process and successfully predict the thermomechanical behaviour of 3D printed designs in order to ‘print right the first time’.”
“With the addition of Solvay’s new AM grades, we now have a wider portfolio of 3D printing grades in Digimat to provide cutting-edge new materials to push the design and application boundaries in the dynamic market,” added Roger Assaker, CEO of e-Xstream Engineering and Chief Material Strategist for MSC Software. “As a result of our partnership, we bridge the gap in simulation engineering between high-performance polymers and demanding printing processes such as fused filament fabrication.”
