Ultimaker
Essentium, eSUN and Polymaker join Ultimaker Material Alliance Program at TCT Asia.
At TCT Asia this week, another three 3D printing materials companies have announced their commitment to Ultimaker’s Materials Alliance Program.
First announced at RAPID + TCT last year, Essentium, eSUN and Polymaker, join the desktop 3D printing leader’s initiative which aims to expand the choice of materials and applications for extrusion-based 3D printing.
Jos Burger, CEO at Ultimaker explained: “By offering material profiles directly to millions of end users via the Ultimaker Marketplace, we unlock new 3D printing applications for different industries. Essentium, eSUN, and Polymaker and are well-respected material companies, offering unique material properties that are relevant for engineers working in a wide range of industries. I am proud to recognize their commitment to the Ultimaker Material Alliance during TCT ASIA.“
In addition to print profiles from the likes of DSM, BASF and Clariant, the new profiles are now available to download in the Ultimaker Marketplace.
First, Essentium is offering print profiles for its Ultrafuse-Z PCTG, an industrial grade filament created in partnership with BASF, that has been specifically formulated to be ESD safe, making it suitable for electronics manufacturing.
Chinese filament manufacturer, eSUN, joins the alliance with material print profiles for its PETG, ePA-CF, and HIPS (High Impact Polystyrene) materials, which the company’s CEO, Dr. Yihu Yang said will allow engineers to “speed up the development of eco-friendly 3D printed products by using renewable resources.”
Finally, Polymer is offering profiles for its PolyMide PA6-CF, PolyMide CoPA and PolyCast filaments. Commenting on the news, Polymaker President, Dr. Xiaofan Luo, commented: “I believe they will open up countless new applications for a greater number of engineers.”
Visitors can learn more at TCT Asia which takes place on at SNEIC, Shanghai this week.
