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PostProcess Technologies: Driving time & cost savings for the 3D printing resin removal process

This white paper explores a new approach to the cumbersome, messy, and lengthy post-printing processes commonly associated with SLA, DLP, and CLIP resin removal with IPA and TPM.

In this TCT Approved White Paper, PostProcess Technologies explores a new approach to the cumbersome, messy, and lengthy post-printing processes commonly associated with SLA, DLP, and CLIP resin removal with IPA and TPM.

Learn how this technology provides decreased processing times, increased throughput, increased detergent longevity, and improved safety for resin-based 3D printed parts.

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