Nikon SLM Solutions and Materialise have announced a strategic co-development partnership to create a fully integrated data preparation workflow.
Announced ahead of Formnext, the two companies will combine their software capabilities to provide complete, build-ready job files, including build layout, toolpath generation, laser allocation, and machine parameters, in a validated workflow, while maintaining traceability and process stability. Advanced users will also be able to optimise toolpaths, assign laser strategies, and configure machine parameters within an OEM-validated environment.
“This partnership represents a major step forward in industrialising metal additive manufacturing,” said Sam O’Leary, CEO of Nikon SLM Solutions. “By integrating Materialise’s software expertise with our proven NXG technology, we’re delivering a platform where advanced control and repeatability meet scalability. It’s a powerful example of co-creation — one that benefits the entire AM ecosystem.”
Laura Griffiths
The partnership also sees the introduction off a new SLMX file format that supports richer machine data, complete build files, and flexible workflow capability, with future plans for integration with Materialise’s CO-AM platform.
“Advanced manufacturers are sending a clear message: scaling from NPI to series production demands both flexibility and validation,” said Brigitte de Vet, CEO of Materialise. “Together with Nikon SLM, we’re building an integrated build processor that connects seamlessly from leading CAD/CAM systems such as Magics, Siemens, and PTC to fully build-ready job files — with no need to add machine-dependent information. By combining deep customisation with OEM validation, we’re giving manufacturers the confidence to scale to repeatable series production.”
In addition, Nikon SLM Solutions has also validated the new Materialise NextGen SLM Build Processor (BP). The new NXG SLM BP is said to be geared towards the extreme data throughput of multi-laser, high-speed LPBF systems, such as Nikon SLM's flagship NXG line, to generate optimised scan strategies for higher machine utilisation, and support OEM verified parameters and advanced customisation. Using the Materialise Build Processor Software Development Kit (BPSDK), customers can also tailor their toolpath strategies to specific applications within a secure framework to protect IP.
