Visitors attend 2014 AMUG Conference.
The Additive Manufacturing Users Group (AMUG) has opened its scholarship application process for additive manufacturing and 3D printing education and professional development at its annual conference taking place in Jacksonville, Florida.
The scholarships, established in the memory of Guy Bourdeau and Randy Stevens, two long-time supporters of the users group, will award one student and educator with a passion for additive manufacturing with the chance to attend one of the most prestigious events on the AM calendar.
Mark Barfoot, AMUG president said, “The AMUG Conference is a unique experience where information is freely exchanged to promote education, training and knowledge that helps individuals get the most from additive manufacturing. Through these scholarships, we can offer that experience to a student and an educator that might otherwise be unable to attend.”
The Guy E. Bourdeau Scholarship, founded by Guy's wife, Renee Bourdeau, is awarded annually to one college student, who can demonstrate an emphasis on additive manufacturing and its integration in his/her professional field.
Barfoot continued, “These scholarships embody Guy’s and Randy’s spirit and passion for additive manufacturing, and they continue the legacy of two giving gentlemen.”
The Randy Stevens Scholarship, founded by Randy's employer, In'Tech Industries, is awarded annually to one professor or teacher who demonstrates a focus on additive manufacturing. The scholarship will be awarded to an individual that inspires others to pursue additive manufacturing in their continuing education and professional endeavours.
Kaiyi Jiang, 2014 Guy E. Bourdeau Scholarship recipient.
Kaiyi Jiang, the 2014 recipient of the Guy E. Bourdeau Scholarship, said, “AMUG 2014 was an unforgettable experience in my life. I felt that I was plugged into a powerful source and enriched by new knowledge every day. I've never felt more welcomed and invited to join in activities and conversations.”
Both scholarships cover travel, lodging, meals and conference registration fees. Applications are being accepted until February 27, 2015.
