EOS M 290 with IPCM M pro
The IPCM M pro alongisde the EOS M 290 platform.
EOS, a leading company in the field of industrial 3D printing, has launched a supporting material handling solution for its EOS M 290 platform.
Presenting the metal 3D printing system and accompanying IPCM M pro material handling system at EMO Hannover, EOS has sought to simplify industrial 3D printing and make it a more attractive method of manufacturing.
IPCM M pro can connect to the EOS M 290 via coupling points inside the machine’s special process chamber door. With both systems working in tandem, users can benefit by the fast and safe transportation of materials out of the M 290, sieving it prior to its refill back into the printer.
The material not fused during the build is the material at focus during this process. Thanks to the IPCM M pro, material can be conveyed out of the M 290 without the process chamber door being opened, and thus without the operator coming into direct contact with it. It works with a vacuum pump moving the powder out of the M 290 and into the IPCM M pro, where it is sieved in inert gas at a throughput of 120 kilograms of material in 30 minutes. With the material coming out the other side ready to use for a new building process, the powder cycle starts anew.
EOS’ M 290 system has been installed over 500 times worldwide, according to the company, and now with the IPCM M pro to support it, and make the production process easier and safer, a continued rate of adoption is expected at EOS HQ.
“Industrial 3D printing has proven its worth as a manufacturing method across industries and is being increasingly used for serial production,” said Dr Tobias Abeln, Chief Technical Officer at EOS. “Companies should therefore consider now how they could make best use of the technology to strengthen their business. The EOS portfolio gives companies one single source for all the elements they need to successfully set up and leverage additive manufacturing to meet the challenges of production with an established, future-proof technology.”
